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AIT Develops Temporary Bonding Wax

Designed for thinning applications

By: Catherine Diamon

AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of thinning applications, in particular for the dies and wafers of cell phones, cameras and tablets. 

AIT’s wax-like media provides melting points of 80ºC and 160ºC for different processing requirements. The bonding medium can be dissolved with IPA or acetone. AIT says its temporary bonding media has been proven useful in all of the four primary methods for wafer thinning: mechanical grinding, chemical mechanical polishing (CMP), wet etching and atmospheric downstream plasma (ADP), and dry chemical etching (DCE).

While back-grinding tapes are used in many applications in place of traditional wax solutions, a temporary bonding wax that can be applied to the thickness of 10 micron still provides many advantages over the thicker back-grinding tapes, the company says. This is particularly true for more aggressive processes and more fragile wafers.

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